Inductive Processes Screen Printing Equipment Tunnel Drying Oven

• After-sales Service: 24h*7
• Warranty: One Year
• Movement Way: Combined
• Atomization: Gas Atomization
• Flow: Parallel Flow
• Heating Mode: Tunnel Style
• Model NO.: Tunnel style
• Material Status: Strap
• Drying Medium: Superheated Steam
• Operation Pressure: Atmospheric Pressure
• Operational Method: Continuous
• Transport Package: Standard
• Specification: W 1420 * H 800 * L 4450 (mm)
• Trademark: HOPO
• Origin: China
• Production Capacity: 3000pieces/Year

Product Description

Product Description

Function Description

The drying oven is used in the chip resistance process; Drying the printing layer after various printing operations on ceramic substrates, equipped with multiple temperature zones, each temperature zone is independently controlled, has become an indispensable main production equipment in the chip resistance industry.
Drying furnace is a chip resistor process; for the ceramic substrate for a variety of printing after the printing layer for drying operations, the equipment is equipped with a number of temperature zones, each temperature zone is independently controlled, has been the chip resistor industry is indispensable to the main production equipment.

Product Parameters

 

specifications	specification
Function Description	The drying oven is used in the chip resistance process; Drying the printing layer after various printing operations on ceramic substrates, equipped with multiple temperature zones, each temperature zone is independently controlled, has become an indispensable main production equipment in the chip resistance industry.
Applicable products	Ceramic substrate
Size	25 inches: length, width, height, (customizable) 36 inches: length, width, height, (customizable) Standard size (3 temperature zones): W 1420 * H 800 * L 4450 (mm)
weight	800kg
colour	Red Sea Blue, Japanese White J22-90A, Cyan Grey-002, Blue-RAL5032
efficiency	≤2mm(internet speed 300mm/min)
Temperature fluctuations	3-5/min, curve ± 5 ºC, left middle right deviation within the same temperature range ± 5 ºC
System	PLC+HMI (touch sensitive), supporting data integration with production management systems such as MES
power supply	3P380V,3P220V/3ø4w/50Hz,20kW
Mesh offset	±5mm
Number of feeding pieces	13 pieces/row of small substrates; 11 pieces/row of middle substrate
service	Support customization