Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment

Product Details
Customization: Available
After-sales Service: Video Technical Support, Online Support
Warranty: 2 Years
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  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
  • Newly Designed Vacuum Metallizing Machine for Passive Component Manufacturing Equipment
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  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-DD-01
Coating
Plating
Substrate
Ceramic
Certification
CE, ISO
Condition
New
Applicable Product Type
01005 0201 Type
Plating Time
3~4h/Batch
Plating Amount
1kk/Batch
Control
Keyence PLC
Transport Package
Vacuum Bag + Wooden Box
Specification
length 1720x width 1700x height 1980 (mm)
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
172.00cm * 170.00cm * 198.00cm
Package Gross Weight
1400.000kg

Product Description

Product Description

Function: Used for chip plating, the plating material is placed on the anode arm, the product is placed on the plating plate, the chip is put into the plating plate manually, the anode arm is placed on the cathode and injected the plating solution into the tank by PLC+PC control, then the motor is used to rotate the cathode so that the product is evenly distributed on the surface, and the rectifier generates the electric current so that it can achieve the purpose of electroplating and the
PLC control makes the arm to be exchanged and cleaned to achieve the purpose of electroplating.
The purpose of plating is achieved by PLC control, arm exchange and cleaning.
Applicable products: Chip resistor Chip inductor Chip capacitor
Applicable product type: 01005 0201
Number of plating barrels: single cylinder, double cylinder, four cylinders (optional)
Control mode: traditional circuit, button (can be upgraded according to customer requirements)
Current output: 60V 75A-4500W rectifier Plating time: 5~6 hours/batch (according to process)
Plating quantity: 1KK/batch (according to process)
Dimension: L1720xW1700xH1980(mm) (based on entity)
Weight: about 1400kg

Product Parameters
Serial number Process Process equipment name HOPO main equipment for each process HOPO supporting each station process auxiliary equipment
1 dubbing Ball Mill
 
Stirring barrel, Slurry Roller
2 Bead Mill
 
3 High Pressure Homogenizer Projected 2024/August
4 casting casting machine Projected 2024/December Stirring barrel
5 Printing Printing Machine  
 
6 Lamination Laminator   Electrode Layer Skew Detector, All Quarter Bar Machine
7 Laminating Hydraulic Press Projected 2024/August Vacuum packaging machine/hydraulic press loading and unloading
8 Cutting Cutting machine   Hot glue automatic foaming and rolling machine, small long material screening machine, hot and cold glue pasting machine, cutting machine
9 Dispensing Gluing discharge furnace(400ºC)
 
BBO automatic spreading machine, MBK loading and unloading machine.
10 Sintering High temperature furnace(1100ºC-1300ºC)
 

 
11 Chamfering Roller mill
 
Vibration screening machine
12 Dip Plating Dip plating machine   Copper paste rolling frame
13 Sintering Sintering Furnace
 

 
14 Plating Centrifugal plating machine   Steel Ball Chip Separator, Steel Ball Shape Screening Machine
15 Testing Testing machine
 

 
16 Appearance Six Side Appearance Inspection   Vibration screening machine
17 Test Kit Bale testing machine + Winding machine   Vibration Screening Machine, Automatic Roll Changing Machine
Detailed Photos

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