Product Description
Applicable product type: 01005 0201 type
Plating time: 3~4H/batch (according to the process)
Plating amount: 1KK/batch (according to the manufacturing process)
Control: Keyence PLC
Appearance dimensions: length 1720x width 1700x height 1980 (mm) (subject to the actual object) )
The equipment operates efficiently
Using centrifugal plating, the plating uniformity is good
Accurate and stable temperature control system, the plating yield is high
Products of different specifications can be electroplated, with strong compatibility
Various electroplating chemicals are circulated through water pipelines, with little chemical pollution
High Precision control valve and good circulation system, high potion reuse rate
Stable product quality, high recognition in the industry
Independent design with invention patent
Product Parameters
Technical Data |
Function |
For chip electroplating, electroplating is placed in the anode arm, the product is placed in the cathode ring, manually put the chip into the rotary poke, through the PLC control to make the anode arm placed on the cathode and the plating solution into the tank, and then the motor rotates the cathode to make the product evenly distributed on the surface, through the rectifier to produce current to achieve the purpose of electroplating, And by PLC control arm exchange and cleaning to achieve the purpose of electroplating. |
Applicable Product |
Chip resistance, chip inductance, chip capacitance. |
Applicable spec. |
01005 |
Remark |
Single cylinder, Double Cylinder, Four Cylinder Available |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)
![Newly Designed Wafer Rotation Plating Machine for The Production of Electronic Components](//www.micstatic.com/athena/img/transparent.png)