Product Description
The drying oven is used in the chip resistor manufacturing process; it is used to dry the printed layer after various printings on ceramic substrates. The equipment is equipped with multiple temperature zones, and each temperature zone is independently controlled. It has become an indispensable main production equipment in the chip resistor industry. .
Applicable products: ceramic substrate
Size: 25 inches: length, width, height, (can be customized)
36 inches: length, Width, height, (can be customized)
Standard size (3 temperature zones): W 1420*H 800*L 4450 (mm)
Weight: approx. 800kg
Color: Red Sea Blue, Japanese White J22-90A, Green Gray-002, Blue-RAL5032
Efficiency: ≤2mm (network speed 300mm/min)
Temperature fluctuation: 3-5/min, curve ±5ºC, left, middle and right deviation of the same temperature zone ±5ºC
System: PLC+HMI ( Touch type), supports data docking with production management systems such as MES
Power supply: 3P380V, 3P220V/3ø4w/50Hz, 20kW
Mesh belt offset: ± 5mm
Number of input pieces: 13 pieces/row of small substrates; 11 pieces/row of medium substrates
Service: Support customization
Warm areas can be customized according to customer needs;
Use PID+PLC+HMI temperature control to achieve a closed -loop temperature control system;
Use rock wool insulation board with a temperature resistance of 700ºC, which has a small thermal conductivity and strong thermal radiation resistance, which can effectively prevent heat penetration;
The lamps all use electrical detectors for real-time monitoring and efficient response to the operation of the temperature control components;
Equipment execution components are all controlled by motors, and data can be uploaded to different production control systems;
Machine data (such as alarms, production capacity and other OEE production parameters) can be uploaded to the customer's production control system;
The size of the equipment is 10% smaller than that of similar products in the industry, and it is better than the customer's factory layout and placement;
The maximum operating speed is as high as 320mm/min, increasing production efficiency by 15%;
The temperature control of the equipment can reach up to ±3°, and the effective time is up to 5 minutes;
The equipment supports connection to the data production management system to facilitate the upgrading and transformation of factory information production management;
Product Parameters
| Thick Film Resistor Process Equipment |
| No |
Process |
Equipment Name |
HOPO Equipment |
No |
Process |
Equipment Name |
HOPO Equipment |
| 1 |
Back conductor Print |
Printer+IR Oven+Unloader |
√ |
10 |
Printing |
Printer+IR Oven+Unloader |
√ |
| C2 |
MK |
| 2 |
Conductor Print |
Printer+IR Oven+Unloader |
√ |
11 |
AOI |
CCD Cosmetic inspection Machine |
√ |
| C1 |
Cosmetic Inspection |
| 3 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
12 |
1st breaking |
1ST Breaking Machine (strip stackers) |
√ |
| 850ºC |
Folded strips |
| 4 |
Resistor Print |
Printer+IR Oven+Unloader |
√ |
13 |
Sputtering |
Sputter MC |
√ |
| R |
C3 |
(Silver Coating Machine) |
| 5 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
14 |
2nd breaking |
Folded Grain Machine |
√ |
| 850ºC |
Folded Grains |
| 6 |
First Protective Layer Printing |
Printer+IR Oven+Unloader |
√ |
15 |
White Edge Sorting |
White Edge Sorting Machine |
√ |
| G1 |
16 |
Electroplating |
01005/0201 |
√ |
| 7 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
Above 0402 |
- |
| 600ºC |
17 |
Magnetic separation |
Magnetic separator + steel ball sorting machine |
√ |
| 8 |
Laser Trimming |
Laser Machine |
- |
18 |
Aging machine |
Electrical characteristics test equipment |
√ |
| 9 |
Second Protective Layer Printing |
Printer+IR Oven+Unloader |
√ |
19 |
Test and Package |
Test Package Machine+Punching Machine+Reeling Machine |
√ |
| G2 |
20 |
FQC |
Final Quality Checking Machine |
√ |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos
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