• Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine
  • Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine
  • Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine
  • Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine
  • Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine
  • Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine

Hopo Electronics Tantalum Capacitor Production Equipment Bonding Machine

After-sales Service: 24h*7
Function: Tantalum Capacitor
Demoulding: Automatic
Condition: New
Certification: ISO, CE
Warranty: 24 Months
Customization:
Manufacturer/Factory, Group Corporation
Gold Member Since 2023

Suppliers with verified business licenses

Anhui, China
Importers and Exporters
The supplier has import and export rights
Patents Awarded
The supplier had awarded 1 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
to see all verified strength labels (22)
  • Overview
  • Product Description
  • Company Profile
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-T-ZJ01
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Transport Package
Vacuum Bag + Wooden Box
Specification
L3000*W1350*H1800mm
Trademark
HOPO
Origin
China

Product Description

Product Description

Applicable product categories Tantalum capacitors
Applicable air pressure 5-6kgf;Stabilized pressure (dry air)
Applicable product size B case (can be customized)
Body color RAL6017 (can be customized)
Power supply Three-phase 380V, 50HZ
Equipment size L3000*W1350*H1800mm (according to the entity to prevail)
Height of the operating table 850±50mm
Running cycle ≥4.5PCS/sec.
Crop rate of equipment 85
Equipment operation platform Touch screen/PC monitor/operation buttons
Equipment control system PLC+ICC control
Vegetable supply method  Vegetable strip frame feeding
Vegetable handling method Turntable handling, Tex 16-index cam splitter.
Welding method Resistance welding
Detecting method for the presence or absence of the pixel Keens high precision fiber optic sensors.
Proton position detection method CCD detection
Silver counting system Musashi
Machine weight Weight Approx. 2200KG
 

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Detailed Photos

Hopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding MachineHopo Electronics Tantalum Capacitor Production Equipment Bonding Machine

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Gold Member Since 2023

Suppliers with verified business licenses

Manufacturer/Factory, Group Corporation
Registered Capital
30000000 RMB
Plant Area
>2000 square meters