Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes

Product Details
Customization: Available
After-sales Service: 7*24h
Voltage: 380V
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW
  Support payments in USD
Secure payments: Every payment you make at Made-in-china.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Manufacturer/Factory & Trading Company
Secured Trading Service
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (22)
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
  • Wafer Rotation Plating Machine for Electronic Component Wafer Plating Processes
Find Similar Products
  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
Q-EP01
Warranty
2 Years
Certification
CE, ISO
Applicable Product Type
01005 0201 Type
Plating Time
3~4h/Batch
Plating Amount
1kk/Batch
Control
Keyence PLC
Transport Package
Vacuum Bag + Wooden Box
Specification
length 1720x width 1700x height 1980 (mm)
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
172.00cm * 170.00cm * 198.00cm
Package Gross Weight
580.000kg

Product Description

Product Description

Applicable product type: 01005 0201 type
Plating time: 3~4H/batch (according to the process)
Plating amount: 1KK/batch (according to the manufacturing process)
Control: Keyence PLC
Appearance dimensions: length 1720x width 1700x height 1980 (mm) (subject to the actual object) )
The equipment operates efficiently
Using centrifugal plating, the plating uniformity is good
Accurate and stable temperature control system, the plating yield is high
Products of different specifications can be electroplated, with strong compatibility
Various electroplating chemicals are circulated through water pipelines, with little chemical pollution
High Precision control valve and good circulation system, high potion reuse rate
Stable product quality, high recognition in the industry
Independent design with invention patent

Product Parameters
Technical Data
Function For chip electroplating, electroplating is placed in the anode arm, the product is placed in the cathode ring, manually put the chip into the rotary poke, through the PLC control to make the anode arm placed on the cathode and the plating solution into the tank, and then the motor rotates the cathode to make the product evenly distributed on the surface, through the rectifier to produce current to achieve the purpose of electroplating, And by PLC control arm exchange and cleaning to achieve the purpose of electroplating.
Applicable Product Chip resistance, chip inductance, chip capacitance.
Applicable spec. 01005
Remark Single cylinder, Double Cylinder, Four Cylinder Available
Detailed Photos

Wafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating ProcessesWafer Rotation Plating Machine for Electronic Component Wafer Plating Processes

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier