Manufacturing Equipment for Electrical Electronic Product Substrate Split Machine

• After-sales Service: 24h*7
• Warranty: 2-Year
• Application: Passive Component Manufacturing
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Nonmetal
• Model NO.: HOPO-FP01
• Structure Type: Gantry Type
• Laser Classification: Free Electron Laser
• Laser Technology: Laser Flame Cutting
• Applicable Spec: 01005/0201
• Speed: 5-6 PC/Min
• Coloer: Blue
• Weights: 460kg
• Transport Package: Vacuum Bag + Wooden Box
• Specification: 1500x length, 1000x width, and 1800x height (mm)
• Trademark: HOPO
• Origin: China

Product Description

Product Parameters

Technical Data
Function	Its function is to remove the white edge of the substrate, fragment it, and then collect the segmented substrate into the material box
Applicable spec.	01005/0201
Speed	5-6 pc/min(Net fragmentation speed)

 

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Detailed Photos