Customization: | Available |
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Automatic Grade: | Automatic |
Driven Type: | Pneumatic |
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Technical Parameter |
|
Applicable product type |
01005 0201 type |
Plating time |
3~4H/batch |
Plating quantity |
1KK/batch |
Control |
Keyence PLC |
Dimensions |
L1720xW1700xH1980(mm) |
Coloer |
white |
weights |
690kg |
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Function: Used for chip plating, the plating material is placed on the anode arm, the product is placed on the plating plate, the chip is put into the plating plate manually, the anode arm is placed on the cathode and injected the plating solution into the tank by PLC+PC control, then the motor is used to rotate the cathode so that the product is evenly distributed on the surface, and the rectifier generates the electric current so that it can achieve the purpose of electroplating and the PLC control makes the arm to be exchanged and cleaned to achieve the purpose of electroplating. The purpose of plating is achieved by PLC control, arm exchange and cleaning.
Applicable products: Chip resistor Chip inductor Chip capacitor
Applicable product type: 01005 0201
Number of plating barrels: single cylinder, double cylinder, four cylinders (optional)
Control mode: traditional circuit, button (can be upgraded according to customer requirements)
Current output: 60V 75A-4500W rectifier
Plating time: 5~6 hours/batch (according to process)
Plating quantity: 1KK/batch (according to process)
Dimension: L1720xW1700xH1980(mm) (based on entity)
Weight: about 1400kg