Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine

Product Details
Customization: Available
Automatic Grade: Automatic
Driven Type: Pneumatic
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Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
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The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
  • Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine
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  • Overview
  • Product Description
  • Company Profile
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
Q-EP01
Precision
High Precision
Speed
High Speed
Demoulding
Automatic
Condition
New
Certification
ISO, CE
Warranty
24 Months
Installation
Vertical
Mould Life
300,000-1,000,000 Shots
After-Sales Service
24h*7
Function
Wafer
Transport Package
Vacuum Bag + Wooden Box
Specification
L1720xW1700xH1980(mm)
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
1200.00cm * 1500.00cm * 1800.00cm
Package Gross Weight
670.000kg

Product Description

Product Description
 

Technical Parameter

Applicable product type

01005 0201 type

Plating time

3~4H/batch

Plating quantity

1KK/batch

Control

 Keyence PLC

Dimensions

L1720xW1700xH1980(mm)

Coloer

white

weights

690kg

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Product Parameters

Function: Used for chip plating, the plating material is placed on the anode arm, the product is placed on the plating plate, the chip is put into the plating plate manually, the anode arm is placed on the cathode and injected the plating solution into the tank by PLC+PC control, then the motor is used to rotate the cathode so that the product is evenly distributed on the surface, and the rectifier generates the electric current so that it can achieve the purpose of electroplating and the PLC control makes the arm to be exchanged and cleaned to achieve the purpose of electroplating. The purpose of plating is achieved by PLC control, arm exchange and cleaning.
Applicable products: Chip resistor Chip inductor Chip capacitor
Applicable product type: 01005 0201
Number of plating barrels: single cylinder, double cylinder, four cylinders (optional)
Control mode: traditional circuit, button (can be upgraded according to customer requirements)
Current output: 60V 75A-4500W rectifier
Plating time: 5~6 hours/batch (according to process)
Plating quantity: 1KK/batch (according to process)
Dimension: L1720xW1700xH1980(mm) (based on entity)
Weight: about 1400kg

Detailed Photos

Manufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating MachineManufacturing Equipment for Electrical Electronic Product Chip Rotating E-Plating Machine

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