Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine

Product Details
Customization: Available
Automatic Grade: Automatic
Driven Type: Pneumatic
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Audited by an independent third-party inspection agency

Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
  • Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine
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  • Overview
  • Company Profile
  • Product Description
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-DD-ZT-01
Precision
High Precision
Speed
High Speed
Demoulding
Automatic
Condition
New
Certification
ISO, CE
Warranty
24 Months
Installation
Vertical
Mould Life
>1, 000, 000 Shots
After-Sales Service
24h*7
Function
Stacker
Transport Package
Vacuum Bag + Wooden Box
Specification
1200*1500*1500
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
1200.00cm * 1500.00cm * 1500.00cm
Package Gross Weight
333.000kg

Product Description

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Product Description

Technical Data

Function

Divide ceramic substrates into strips and arrange them into jigs with high efficiency

Applicable spec.

 0402/0603/0805/1206 and other types.

Speed

0402( about 220pcs/min); 0603~1210(about 180pcs/min);

2010~2512(about 80pcs/min)

Product Parameters

Technical Data

Function

Divide ceramic substrates into strips and arrange them into jigs with high efficiency

Applicable spec.

 0402/0603/0805/1206 and other types.

Speed

0402( about 220pcs/min); 0603~1210(about 180pcs/min);

2010~2512(about 80pcs/min)

Detailed Photos

Capacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding MachineCapacitor Resistor Inductor Manufacturing Machinery Substrate Folding Machine

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