Passive Component Ceramic Substrate Printing Machine

Product Details
Customization: Available
After-sales Service: Video Technical Support, Online Support
Warranty: 2years
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Audited by an independent third-party inspection agency

Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • Passive Component Ceramic Substrate Printing Machine
  • Passive Component Ceramic Substrate Printing Machine
  • Passive Component Ceramic Substrate Printing Machine
  • Passive Component Ceramic Substrate Printing Machine
  • Passive Component Ceramic Substrate Printing Machine
  • Passive Component Ceramic Substrate Printing Machine
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  • Overview
  • Product Description
  • Product Parameters
  • Company Profile
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-YS01
Style
Substrate Electrode Printing
Structure
Electrode Circuit
Color & Page
Two-Sided
Application
printed Circuit
Print Interface
USB3.0
System Supported
Windows2000
Automatic Grade
Automatic
Driven Type
Electric
Precision
High Precision
Speed
High Speed
Name
Printing Machine
Equipment C /T
21 Pieces/Min
Yield
More Than 99%
Control
PLC+HMI
Color
Blue
Weight
360kg
Transport Package
Vacuum Bag + Wooden Box
Specification
L2850x W1005x H1200 (mm)
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
285.00cm * 100.00cm * 120.00cm
Package Gross Weight
360.000kg

Product Description

Product Description

Ceramic substrate
Applicable product types: 0402, 0603, 0805, 1206, 1210, 2010, 2512 types
Equipment C /T: 21 pieces/min
Yield: more than 99%
Control: PLC+HMI

Product Parameters

Technical Parameter

Function

The printer is used in Chip resistor manufacturing process to print forward and back leads,G1,G2,R, characters and other printing for ceramic substrates. (AOI&Automatic ink wipe machine option)

Applicable specifications

0402,0603,0805,1206,1210,2010,2512

Speed

42PC/Min (MAX)(Double Head)

Precision

 0.015mm

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Detailed Photos

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