Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines

Product Details
Customization: Available
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Warranty: One Year
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Patents Awarded
The supplier had awarded 1 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
  • Obtained CE Marking Substrate Granulation Equipment 2st Cutting Machines
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  • Overview
  • Company Profile
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
R-CB70, R-CB180
Applicable Product Type
0402; 0603; 0805; 1206;
Equipment C/T
70 Strips/Min
Yield
98% or More
Control
PLC+HMI
Transport Package
Standard
Specification
L1300x W550x H1850(mm)
Trademark
HOPO
Origin
China
Production Capacity
3000pieces/Year

Packaging & Delivery

Package Size
130.00cm * 55.00cm * 185.00cm
Package Gross Weight
230.000kg

Product Description

Crusher R-CB70:

Ceramic substrate

Applicable product type: 0402; 0603; 0805; 1206; 1210; 2010; 2512; 02-4D; 03-4D;

Equipment C/T: 70 pieces/min

Yield: Over 98%

Control: PLC+HMI

Appearance dimensions: L1400xW600xH1700 (mm) (subject to entity)

Crusher R-CB180:

Ceramic substrate

Applicable product types: 0402060308051206, 12102010, 2512 types

Equipment C/T: 180pcs/min or above from 402 to 1206, 120pcs/min or above from 2010 to 2512

Yield: 99%

Control: PLC+HMI

Appearance dimensions: length 1300x width 550xheight 1850 (mm) (subject to entity)

Efficient equipment operation, with a crop utilization rate of up to 85%

Stable product quality and high industry recognition

Independently designed with invention patents and practical patents
Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Product Parameters

Technical Data

Function

Put the material strip into

the vibrating plate, and use the vibrating plate feeding method to fold the pellets

Applicable spec.

02-4D/03-4D and or for customer

Speed

70 Strips/Min

Detailed Photos

Obtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting Machines

Obtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting MachinesObtained CE Marking Substrate Granulation Equipment 2st Cutting Machines

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