Product Description
Applicable products: 150mm*150mm
Equipment power supply: AC220V/10A/50Hz
Equipment CT: ≤18S
Vacuum box working pressure 0~-720 mmHg
Adhesive film width: 200mm±2mm
PE film width: 160±2mm
PET film thickness: film thickness: 0.038±0.01mm
Heating temperature: 0~200ºC
Lamination thickness:0~5mm thickness
Incoming roll diameter: φ460mm (Max)
Equipment size: L4.2*W2.0*H2.0m
Packaging: a variety of packaging methods to share (can be customized)
Product Parameters
| Serial number |
Process |
Process equipment name |
HOPO main equipment for each process |
HOPO supporting each station process auxiliary equipment |
| 1 |
dubbing |
Ball Mill |
|
Stirring barrel, Slurry Roller |
| 2 |
Bead Mill |
|
| 3 |
High Pressure Homogenizer |
Projected 2024/August |
| 4 |
casting |
casting machine |
Projected 2024/December |
Stirring barrel |
| 5 |
Printing |
Printing Machine |
|
|
| 6 |
Lamination |
Laminator |
|
Electrode Layer Skew Detector, All Quarter Bar Machine |
| 7 |
Laminating |
Hydraulic Press |
Projected 2024/August |
Vacuum packaging machine/hydraulic press loading and unloading |
| 8 |
Cutting |
Cutting machine |
|
Hot glue automatic foaming and rolling machine, small long material screening machine, hot and cold glue pasting machine, cutting machine |
| 9 |
Dispensing |
Gluing discharge furnace(400ºC) |
|
BBO automatic spreading machine, MBK loading and unloading machine. |
| 10 |
Sintering |
High temperature furnace(1100ºC-1300ºC) |
|
|
| 11 |
Chamfering |
Roller mill |
|
Vibration screening machine |
| 12 |
Dip Plating |
Dip plating machine |
|
Copper paste rolling frame |
| 13 |
Sintering |
Sintering Furnace |
|
|
| 14 |
Plating |
Centrifugal plating machine |
|
Steel Ball Chip Separator, Steel Ball Shape Screening Machine |
| 15 |
Testing |
Testing machine |
|
|
| 16 |
Appearance |
Six Side Appearance Inspection |
|
Vibration screening machine |
| 17 |
Test Kit |
Bale testing machine + Winding machine |
|
Vibration Screening Machine, Automatic Roll Changing Machine |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos
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