Product Description
Applicable product type:01005 0201 type
Plating time:3~4H/batch(according to process)
Plating quantity:1KK/batch(according to the process)
Control: Keyence PLC
Dimensions:L1720xW1700xH1980(mm)
Product Parameters
Technical Data |
Function |
For chip electroplating, electroplating is placed in the anode arm, the product is placed in the cathode ring, manually put the chip into the rotary poke, through the PLC control to make the anode arm placed on the cathode and the plating solution into the tank, and then the motor rotates the cathode to make the product evenly distributed on the surface, through the rectifier to produce current to achieve the purpose of electroplating, And by PLC control arm exchange and cleaning to achieve the purpose of electroplating. |
Applicable Product |
Chip resistance, chip inductance, chip capacitance. |
Applicable spec. |
01005 |
Remark |
Single cylinder, Double Cylinder, Four Cylinder Available |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos