CE Certified Leading Chip Rotating Centrifugal E-Plating Machine

Product Details
Customization: Available
Automatic Grade: Automatic
Driven Type: Pneumatic
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Audited by an independent third-party inspection agency

Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
  • CE Certified Leading Chip Rotating Centrifugal E-Plating Machine
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  • Overview
  • Product Parameters
  • Detailed Photos
  • Company Profile
Overview

Basic Info.

Model NO.
HOPO-JP-DD01
Precision
High Precision
Speed
High Speed
Demoulding
Automatic
Condition
New
Certification
ISO, CE
Warranty
24 Months
Installation
Vertical
After-Sales Service
24h*7
Function
Plating Equipment
Transport Package
Vacuum Bag + Wooden Box
Specification
1500*1500*1800
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
1500.00cm * 1500.00cm * 1800.00cm
Package Gross Weight
780.000kg

Product Description

Product Parameters
Technical Data
Function For chip electroplating, electroplating is placed in the anode arm, the product is placed in the cathode ring, manually put the chip into the rotary poke, through the PLC control to make the anode arm placed on the cathode and the plating solution into the tank, and then the motor rotates the cathode to make the product evenly distributed on the surface, through the rectifier to produce current to achieve the purpose of electroplating, And by PLC control arm exchange and cleaning to achieve the purpose of electroplating.
Applicable Product Chip resistance, chip inductance, chip capacitance.
Applicable spec. 01005
Remark Single cylinder, Double Cylinder, Four Cylinder Available
Detailed Photos

CE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating MachineCE Certified Leading Chip Rotating Centrifugal E-Plating Machine

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.

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