• Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine
  • Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine
  • Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine
  • Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine
  • Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine
  • Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine

Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine

After-sales Service: 24h*7
Function: Plating Machine
Demoulding: Automatic
Condition: New
Certification: ISO, CE
Warranty: 24 Months
Customization:
Manufacturer/Factory, Group Corporation
Gold Member Since 2023

Suppliers with verified business licenses

Anhui, China
Importers and Exporters
The supplier has import and export rights
Patents Awarded
The supplier had awarded 1 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
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  • Overview
  • Company Profile
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-DZ-02
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Pneumatic
Mould Life
>1,000,000 Shots
Transport Package
Vacuum Bag + Wooden Box
Trademark
HOPO
Origin
China

Product Description

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.

Product Parameters
Technical Data
Function For chip electroplating, electroplating is placed in the anode arm, the product is placed in the cathode ring, manually put the chip into the rotary poke, through the PLC control to make the anode arm placed on the cathode and the plating solution into the tank, and then the motor rotates the cathode to make the product evenly distributed on the surface, through the rectifier to produce current to achieve the purpose of electroplating, And by PLC control arm exchange and cleaning to achieve the purpose of electroplating.
Applicable Product Chip resistance, chip inductance, chip capacitance.
Applicable spec. 01005
Remark Single cylinder, Double Cylinder, Four Cylinder Available
Detailed Photos

Pulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating MachinePulse Power Plating Semiconductor Microelectronic Chip Automatic Wafer Rotary Plating Machine

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Gold Member Since 2023

Suppliers with verified business licenses

Manufacturer/Factory, Group Corporation
Registered Capital
30000000 RMB
Plant Area
>2000 square meters