| Customization: | Available |
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| Automatic Grade: | Automatic |
| Driven Type: | Electric |
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Ceramic Substrate
Applicable product type: 0402, 0603, 0805, 1206, 1210, 2010, 2512, 02-4D,, 03-4D type
Equipment C/T: 20S/fixture
Yield:/
Control: PLC+HMI
Dimensions: L2000xW530xH1435(mm)
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Technical Data |
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Function |
Take the silver paste by dipping the foam, and then coat the silver paste on the chip end face in the row jig, and then heat the silver paste to dry. |
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Applicable spec. |
02-4D/03-4D and or for customer |
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Speed |
20s/jig(Print 2 times, 4 working platform) |
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
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