Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine

Product Details
Customization: Available
Automatic Grade: Automatic
Driven Type: Pneumatic
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Audited by an independent third-party inspection agency

Patents Awarded
The supplier had awarded 5 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Overseas Services
The supplier provides overseas services and supports countries including All the world.

Overseas service content includes Debugging, Maintain, Repair, Training, Equipment Installation.
R&D Capabilities
The supplier has 14 R&D engineers, you can check the Audit Report for more information
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  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
  • Chip Thick Film Resistor Process Equipment Water Pressure Packaging Machine
Find Similar Products
  • Overview
  • Company Profile
  • Product Parameters
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-SY-BZJ-01
Demoulding
Automatic
Condition
New
Certification
ISO, CE
Warranty
24 Months
Installation
Vertical
Mould Life
>1, 000, 000 Shots
After-Sales Service
24h*7
Function
Mlcc Packaging Machine
Transport Package
Vacuum Bag + Wooden Box
Specification
1500x length, 1000x width, and 1800x height (mm)
Trademark
HOPO
Origin
China

Packaging & Delivery

Package Size
150.00cm * 140.00cm * 180.00cm
Package Gross Weight
450.000kg

Product Description

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Product Parameters
No Process Equipment Name HOPO Equipment
1 Ball mill  Ball Mill Machine
 
2 Homogenizing and Dispersing homogenizer (√)
3 Stirring Pulp Mixer Machine
 
4 Tape making Casting machine (√)
5 Printing Printing machine/Drying Oven
6 Lamination Laminating Machine
7 Water Pressure  WIP laminator (warm water equalizer)
8 Spreader Spreader Machine
9 Cutting Cutting Machine
10 Furnace/BBO Sintering Furnace Machine
 
11 Sintering Sintering Furnace Machine
 
12 Rolling Tumbling Machine
 
13 End Closures (Silver Dipping) Silver Dipping Machine
14  Furnace Sintering Furnace Machine
 
15 Plating Plating line
 
16 Testing Test machine
 
17 Cosmetic Six-sided Cosmetic inspection
18 Packaging Package testing machine
Detailed Photos

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