• Hopo Passive Component Manufacturing Equipment Ceramic Substrate
  • Hopo Passive Component Manufacturing Equipment Ceramic Substrate
  • Hopo Passive Component Manufacturing Equipment Ceramic Substrate
  • Hopo Passive Component Manufacturing Equipment Ceramic Substrate
  • Hopo Passive Component Manufacturing Equipment Ceramic Substrate
  • Hopo Passive Component Manufacturing Equipment Ceramic Substrate

Hopo Passive Component Manufacturing Equipment Ceramic Substrate

After-sales Service: 24h*7
Function: Abrasion Resistance, High Temperature Resistance
Demoulding: Pull Core
Condition: New
Certification: ISO, CE
Warranty: 24 Months
Customization:
Manufacturer/Factory, Group Corporation
Gold Member Since 2023

Suppliers with verified business licenses

Anhui, China
Importers and Exporters
The supplier has import and export rights
Patents Awarded
The supplier had awarded 1 patents, you can check the Audit Report for more information
Customization from Designs
The supplier provides design based customization services
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
to see all verified strength labels (22)
  • Overview
  • Product Description
  • Company Profile
  • Detailed Photos
Overview

Basic Info.

Model NO.
HOPO-YS-ST01
Automatic Grade
Semiautomatic
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Vacuum Bag + Wooden Box
Specification
L3200xW1100xH1200
Trademark
HOPO
Origin
China

Product Description

Product Description

Function Description: The printing machine is used to print ceramic substrate C1, C2, R, G1, G2, Marking, etc. in the chip resistor process, and this equipment is suitable for small and medium-sized substrates from 0402 to 4020;
Applicable products: 0402, 0603, 0805, 1206, 1210, 2010, 2512, 4020 and above.
Dimensions: 25" - L2600xW1100 x H1200 (mm) 
                     36" - L3200xW1100xH1200 (mm) 
Weight: 750kg
Color: Red Sea Blue, Japan White J22-90A, Green Gray-002, Blue-RAL5032
Efficiency: 27 pieces / Min (MAX)
Yield: 98% or more
System: PLC + HMI (touch), support MES and other production management systems data docking
Power supply: AC220V/ AC110V-10A/50-60Hz 
Air supply: 5kg/cm²
Printing area: 70mm (MAX)

Company Profile

HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
 

Detailed Photos

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Gold Member Since 2023

Suppliers with verified business licenses

Manufacturer/Factory, Group Corporation
Registered Capital
30000000 RMB
Plant Area
>2000 square meters