Product Description
| No |
Process |
Equipment Name |
HOPO Equipment |
| 1 |
Ball mill |
Ball Mill Machine |
|
| 2 |
Homogenizing and Dispersing |
homogenizer |
(√) |
| 3 |
Stirring |
Pulp Mixer Machine |
|
| 4 |
Tape making |
Casting machine |
(√) |
| 5 |
Printing |
Printing machine/Drying Oven |
√ |
| 6 |
Lamination |
Laminating Machine |
√ |
| 7 |
Water Pressure |
WIP laminator (warm water equalizer) |
√ |
| 8 |
Spreader |
Spreader Machine |
√ |
| 9 |
Cutting |
Cutting Machine |
√ |
| 10 |
Furnace/BBO |
Sintering Furnace Machine |
|
| 11 |
Sintering |
Sintering Furnace Machine |
|
| 12 |
Rolling |
Tumbling Machine |
|
| 13 |
End Closures (Silver Dipping) |
Silver Dipping Machine |
√ |
| 14 |
Furnace |
Sintering Furnace Machine |
|
| 15 |
Plating |
Plating line |
|
| 16 |
Testing |
Test machine |
|
| 17 |
Cosmetic |
Six-sided Cosmetic inspection |
√ |
| 18 |
Packaging |
Package testing machine |
√ |
Product Parameters
| NO. |
Technological Process |
HOPO MC Name |
Specification |
HOPO MC |
| 1 |
Pressed alloy foil |
Pasting machine |
/ |
√ |
| 2 |
Film applicator (dry film) |
Automatic film applicator |
PP-TM80 |
√ |
| 3 |
Exposure |
Automatic exposure machine |
R-EP50 |
√ |
| 4 |
Develop |
Development etching machine |
R-DE20 |
- |
| 5 |
Hanging plating |
Plating line |
Q-EP01 |
√ |
| 6 |
Pressure dried film |
Automatic film applicator |
PP-TM80 |
√ |
| 7 |
Exposure |
Automatic exposure machine |
R-EP50 |
√ |
| 8 |
Develop |
Development etching machine |
R-DE20 |
- |
| 9 |
Etch |
| 10 |
Dry film removal |
| 11 |
Laser trimming |
Laser machine |
HP-LTR-420 |
√ |
| 12 |
Printed front electrode |
Printer |
R-P25S |
√ |
| 13 |
Printing protective layer G2 |
| 14 |
Printing code |
| 15 |
Sinter |
Precision oven |
Q-K450 |
√ |
| 16 |
Stacking |
1st breaking machine |
R-BB180 |
√ |
| 17 |
Sputtering |
Sputtering machine |
R-VS650-3Z |
√ |
| 18 |
Singulating |
2nd breaking machine |
R-CB180 |
√ |
| 19 |
Barrel plating |
Plating line |
|
- |
| 20 |
Testing and packing |
1.Taping machine |
1.HSQ-3500 |
√ |
| 2.Reel change machine |
2.Q-RL3000 |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos
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