Product Description
This equipment is used for punching paper tape, that is, punching the paper tape through a punching die, so that the paper tape can be used to package chip products and can be used for various types of chip packaging
Product Parameters
High-speed drilling machine specifications |
Specification |
specification |
Function confirmation |
Remark |
Suitable for punching mold |
0402 ; 0603 ; 0805 ; 1206 This model is suitable for all products with the above specifications |
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Through hole |
£Through hole |
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Applicable paper tape |
Width 8mm |
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Utilization rate |
99% |
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air pressure |
5kg/cm² or more ( saturated pressure ) |
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power supply |
Three-phase 22 0V ; 20A |
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operate |
Button operation and touch screen |
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control |
Frequency converter and PLC |
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Appearance size |
Length 1 25 0x Width 700 x Height 1760 (mm) (subject to the actual object) |
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weight |
Approximately 35 0 kg |
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Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos