Product Description
The lamination equipment mainly completes the processes of pattern cutting and peeling, laminating electrode patterns according to process requirements, and laminating capacitor raw materials. Its working principle is:
The equipment unfolds the film with the screen-printed electrode pattern at a set constant tension, cuts the film electrode pattern to the specified size, uses a specific workbench to vacuum absorb and peel the film, and moves it to the predetermined lamination workbench after scanning and positioning by the image positioning system, and laminates the film on the positioned carrier. According to the product production process, the pattern is staggered to form two electrodes, and the required number of layers are laminated with pre-pressing pressure to form the capacitor raw material. Then, the carrier and the capacitor raw material are sent to the protective film covering station by the conveying mechanism to add the protective film, and then to the compacting station to apply a large pressure, and the pressure is maintained for a certain time to make the capacitor raw material dense, and finally sent to the receiving frame to collect the material, completing the entire work cycle.
Lamination is to stack ceramic diaphragms with printed inner electrodes in a staggered manner according to design requirements to form a block. The alignment accuracy of the stacking will directly affect the facing area of the upper and lower electrodes, and thus affect the capacity of the product. The impact of stacking on the capacity of MLCC is mainly reflected in the following aspects:
Alignment accuracy: The alignment accuracy of the stacking equipment is poor, and the displacement will affect the facing area between the upper and lower electrodes. The smaller the facing area, the smaller the corresponding capacity.
Designed number of layers: Usually the equipment will be stacked according to the designed number of layers, but if the computer or sensor is abnormal, resulting in counting errors, it will cause a deviation between the actual number of stacking layers and the designed number of layers, affecting the product capacity;
Thickness of stacked blocks: The higher the temperature and the greater the pressure during stacking, the thinner the block thickness, the thinner the corresponding dielectric diaphragm, and the larger the capacity. However, excessive pressure will cause overall tilting, severe cracking of the dielectric diaphragm, smaller facing area, and smaller capacity.
Broken dielectric interlayer, folded corners, and wrinkled: Broken interlayers are common during the stacking process. Interlayers will cause the corresponding dielectric diaphragm to become thicker and cause a certain degree of displacement. The dielectric diaphragm becomes thicker, the effective facing area becomes smaller, and the corresponding capacity becomes smaller. Folded corners or wrinkles will reduce the corresponding facing area, and at the same time, the dielectric thickness will increase, resulting in a smaller capacity.
Product Parameters
| Serial number |
Process |
Process equipment name |
HOPO main equipment for each process |
HOPO supporting each station process auxiliary equipment |
| 1 |
dubbing |
Ball Mill |
|
Stirring barrel, Slurry Roller |
| 2 |
Bead Mill |
|
| 3 |
High Pressure Homogenizer |
Projected 2024/August |
| 4 |
casting |
casting machine |
Projected 2024/December |
Stirring barrel |
| 5 |
Printing |
Printing Machine |
|
|
| 6 |
Lamination |
Laminator |
|
Electrode Layer Skew Detector, All Quarter Bar Machine |
| 7 |
Laminating |
Hydraulic Press |
Projected 2024/August |
Vacuum packaging machine/hydraulic press loading and unloading |
| 8 |
Cutting |
Cutting machine |
|
Hot glue automatic foaming and rolling machine, small long material screening machine, hot and cold glue pasting machine, cutting machine |
| 9 |
Dispensing |
Gluing discharge furnace(400ºC) |
|
BBO automatic spreading machine, MBK loading and unloading machine. |
| 10 |
Sintering |
High temperature furnace(1100ºC-1300ºC) |
|
|
| 11 |
Chamfering |
Roller mill |
|
Vibration screening machine |
| 12 |
Dip Plating |
Dip plating machine |
|
Copper paste rolling frame |
| 13 |
Sintering |
Sintering Furnace |
|
|
| 14 |
Plating |
Centrifugal plating machine |
|
Steel Ball Chip Separator, Steel Ball Shape Screening Machine |
| 15 |
Testing |
Testing machine |
|
|
| 16 |
Appearance |
Six Side Appearance Inspection |
|
Vibration screening machine |
| 17 |
Test Kit |
Bale testing machine + Winding machine |
|
Vibration Screening Machine, Automatic Roll Changing Machine |
Detailed Photos
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