| Customization: | Available |
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| Automatic Grade: | Automatic |
| Driven Type: | Pneumatic |
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HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
| Thick Film Resistor Process Equipment | |||||||
| No | Process | Equipment Name | HOPO Equipment | No | Process | Equipment Name | HOPO Equipment |
| 1 | Back conductor Print | Printer+IR Oven+Unloader | √ | 10 | Printing | Printer+IR Oven+Unloader | √ |
| C2 | MK | ||||||
| 2 | Conductor Print | Printer+IR Oven+Unloader | √ | 11 | AOI | CCD Cosmetic inspection Machine | - |
| C1 | Cosmetic Inspection | ||||||
| 3 | High Temperature Sintering | Loader+Furnace+Unloader | √ | 12 | 1st breaking | 1ST Breaking Machine (strip stackers) | √ |
| 850ºC | Folded strips | ||||||
| 4 | Resistor Print | Printer+IR Oven+Unloader | √ | 13 | Sputtering | Sputter MC | √ |
| R | C3 | (Silver Coating Machine) | |||||
| 5 | High Temperature Sintering | Loader+Furnace+Unloader | √ | 14 | 2nd breaking | Folded Grain Machine | √ |
| 850ºC | Folded Grains | ||||||
| 6 | First Protective Layer Printing | Printer+IR Oven+Unloader | √ | 15 | White Edge Sorting | White Edge Sorting Machine | √ |
| G1 | 16 | Electroplating | 01005/0201 | √ | |||
| 7 | High Temperature Sintering | Loader+Furnace+Unloader | √ | Above 0402 | - | ||
| 600ºC | 17 | Magnetic separation | Magnetic separator + steel ball sorting machine | √ | |||
| 8 | Laser Trimming | Laser Machine | - | 18 | Aging machine | Electrical characteristics test equipment | √ |
| 9 | Second Protective Layer Printing | Printer+IR Oven+Unloader | √ | 19 | Test and Package | Test Package Machine+Punching Machine+Reeling Machine | √ |
| G2 | 20 | FQC | Final Quality Checking Machine | √ | |||
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Technical Parameter |
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Function |
The printer is used in Chip resistor manufacturing process to print forward and back leads,G1,G2,R, characters and other printing for ceramic substrates. (AOI&Automatic ink wipe machine option) |
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Applicable specifications |
0402,0603,0805,1206,1210,2010,2512 |
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Speed |
42PC/Min (MAX)(Double Head) |
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Precision |
0.015mm |
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