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The drying oven is used in the chip resistor manufacturing process; it is used to dry the printed layer after various printings on ceramic substrates. The equipment is equipped with multiple temperature zones, and each temperature zone is independently controlled. It has become an indispensable main production equipment in the chip resistor industry. .
Applicable products: ceramic substrateThick Film Resistor Process Equipment | |||||||
No | Process | Equipment Name | HOPO Equipment | No | Process | Equipment Name | HOPO Equipment |
1 | Back conductor Print | Printer+IR Oven+Unloader | √ | 10 | Printing | Printer+IR Oven+Unloader | √ |
C2 | MK | ||||||
2 | Conductor Print | Printer+IR Oven+Unloader | √ | 11 | AOI | CCD Cosmetic inspection Machine | √ |
C1 | Cosmetic Inspection | ||||||
3 | High Temperature Sintering | Loader+Furnace+Unloader | √ | 12 | 1st breaking | 1ST Breaking Machine (strip stackers) | √ |
850ºC | Folded strips | ||||||
4 | Resistor Print | Printer+IR Oven+Unloader | √ | 13 | Sputtering | Sputter MC | √ |
R | C3 | (Silver Coating Machine) | |||||
5 | High Temperature Sintering | Loader+Furnace+Unloader | √ | 14 | 2nd breaking | Folded Grain Machine | √ |
850ºC | Folded Grains | ||||||
6 | First Protective Layer Printing | Printer+IR Oven+Unloader | √ | 15 | White Edge Sorting | White Edge Sorting Machine | √ |
G1 | 16 | Electroplating | 01005/0201 | √ | |||
7 | High Temperature Sintering | Loader+Furnace+Unloader | √ | Above 0402 | - | ||
600ºC | 17 | Magnetic separation | Magnetic separator + steel ball sorting machine | √ | |||
8 | Laser Trimming | Laser Machine | - | 18 | Aging machine | Electrical characteristics test equipment | √ |
9 | Second Protective Layer Printing | Printer+IR Oven+Unloader | √ | 19 | Test and Package | Test Package Machine+Punching Machine+Reeling Machine | √ |
G2 | 20 | FQC | Final Quality Checking Machine | √ |