Product Description
Drying furnace is a chip resistor production process; for ceramic substrate for a variety of printing after the printing layer for drying operations, the equipment is equipped with a number of temperature zones, each temperature zone is independently controlled, has been the chip resistor industry indispensable to the main production equipment.
Applicable products: Ceramic substrate
Size: 25 inch: length, width, height, (can be customized)
36" : length, width, height, (customizable)
Standard size (3 temperature zones): W 1420 * H 800 * L 4450 (mm)
Weight: about 800kg
Color: red sea blue, Japan white J22-90A, green gray-002, blue-RAL5032
Efficiency: ≤2mm (mesh speed 300mm/min)
Temperature fluctuation: 3-5/min, curve ± 5 ºC, the same temperature zone left and right deviation ± 5 ºC
System: PLC + HMI (touch), support MES and other production management system data docking
Power supply: 3P380V, 3P220V/3ø4w/50Hz, 20kW
Mesh belt offset: ±5mm
Number of feeding pieces: 13 pieces/row for small substrate; 11 pieces/row for medium substrate.
Product Parameters
| Thick Film Resistor Process Equipment |
| No |
Process |
Equipment Name |
HOPO Equipment |
No |
Process |
Equipment Name |
HOPO Equipment |
| 1 |
Back conductor Print |
Printer+IR Oven+Unloader |
√ |
10 |
Printing |
Printer+IR Oven+Unloader |
√ |
| C2 |
MK |
| 2 |
Conductor Print |
Printer+IR Oven+Unloader |
√ |
11 |
AOI |
CCD Cosmetic inspection Machine |
- |
| C1 |
Cosmetic Inspection |
| 3 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
12 |
1st breaking |
1ST Breaking Machine (strip stackers) |
√ |
| 850ºC |
Folded strips |
| 4 |
Resistor Print |
Printer+IR Oven+Unloader |
√ |
13 |
Sputtering |
Sputter MC |
√ |
| R |
C3 |
(Silver Coating Machine) |
| 5 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
14 |
2nd breaking |
Folded Grain Machine |
√ |
| 850ºC |
Folded Grains |
| 6 |
First Protective Layer Printing |
Printer+IR Oven+Unloader |
√ |
15 |
White Edge Sorting |
White Edge Sorting Machine |
√ |
| G1 |
16 |
Electroplating |
01005/0201 |
√ |
| 7 |
High Temperature Sintering |
Loader+Furnace+Unloader |
√ |
Above 0402 |
- |
| 600ºC |
17 |
Magnetic separation |
Magnetic separator + steel ball sorting machine |
√ |
| 8 |
Laser Trimming |
Laser Machine |
- |
18 |
Aging machine |
Electrical characteristics test equipment |
√ |
| 9 |
Second Protective Layer Printing |
Printer+IR Oven+Unloader |
√ |
19 |
Test and Package |
Test Package Machine+Punching Machine+Reeling Machine |
√ |
| G2 |
20 |
FQC |
Final Quality Checking Machine |
√ |
Company Profile
HOPO Technology was founded in 2005. It focuses on the research and development and production of active and passive component equipment, semiconductor equipment, as well as the production of high-precision parts and consumables. Its product technology is well received by customers at home and abroad. HOPO currently has 3 R&D design centers and visual teams, located in Kunshan, Shanghai and Wuxi; in addition, there are Dongguan Branch, Shanghai Branch, Anhui Branch, Malaysia Branch, Taiwan Branch, Suzhou Jinde Electronics, and Suzhou and Laimei PRECISION MACHINERY LIMITED.
The company is eager to combine practice and theory, transform technology into productivity, provide customers with automated and intelligent solutions, and bring social value.
Detailed Photos
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